Adsorption of cupric and plumbous ion by Trichoderma asperellum from ideal solutions

• Autores: Hany de los Angeles Ávila-Chuqiruna, Erika Paola Alayo- Aguirre, Nadiezhda Esperanza Burgos-Wilson, Juan Héctor Wilson-Krugg
• Formato: artículo
• Fecha de Publicación: 2017
• Institución: Universidad Católica de Santa María
• Repositorio: Revistas - Universidad Católica de Santa María
• Lenguaje: español
• OAI Identifier: oai:ojs.revistas.ucsm.edu.pe:article/98
• Enlace del recurso: https://revistas.ucsm.edu.pe/ojs/index.php/veritas/article/view/98
• Nivel de acceso: acceso abierto
• Materia: Trichoderma harzianum; Sulfato de cobre y plomo

The adsorption capacity of copper ion and lead acid by Trichoderma asperellum was determined from ideal solutions of copper and lead (II) sulphate, respectively. Fungal biomass was obtained by cultivating T. viride FP-UNT 01 in aerated bioreactors with potato dextrose serum, which was washed with 0.1N nitric acid (HNO3); The pellets formed were oven dried at 60 ° C for 24 hours. 8g of pellets were placed in a four column system through which a solution of cupric ion at 19ppm and of lead acid at 40ppm concentration respectively was passed. The samples were analyzed by mass spectrometry and the data obtained were analyzed using the Student’s t-test for paired samples. It was found that T. asperellum is capable of adsorbing cupric ion up to 9.1% and plumbous ion up to 24.3% for 6 hours of evaluation. It was concluded that T. asperellum is able to adsorb plumbous ion and cupric ion, being greater its ability to adsorb plumbous ion.