Preliminary aspects of the evaluation and effect of surfactant additives in the process copper electrowinning

• Autores: Vargas, C., Navarro, P.
• Formato: artículo
• Fecha de Publicación: 2010
• Institución: Universidad Nacional Mayor de San Marcos
• Repositorio: Revista UNMSM - IIGEO
• Lenguaje: español
• OAI Identifier: oai:ojs.csi.unmsm:article/434
• Enlace del recurso: https://revistasinvestigacion.unmsm.edu.pe/index.php/iigeo/article/view/434
• Nivel de acceso: acceso abierto
• Materia: Copper; additives; surfactants; electrowinnig; acid mist; cobre; aditivos; surfactantes; electroobtención; neblina ácida

This study aims to evaluate and compare each other, surface-active additives on the inhibition and control of acid mist, as well as different control parameters and operation of the copper electrowinning process, such as surface tension electrolyte effect on current efficiency, energy consumption and cathode quality. The results obtained confirm that the commercial additive Fluoride FC-1100 is an excellent surfactant, and that low doses drastically reduced the surface tension of electrolyte (from 75 dynes / cm to 55 dynes / cm) and therefore allows to reduce acid emissions without interfere with other process parameters such as current efficiency, energy consumption or cathodic quality deposits and obtaining good adhesion. This is not the case of Genapol PF-10, drastically reduces the surface tension and hence the mist generation but shows a detrimental effect on the current efficiency due to low quality cathodic, because the deposits obtained are rugged, rigid and low adhesion; thus it´s not an alternative surfactant. Another is the case Flotanol C-7, the behavior of this reagent is optimal because it reduces the surface tension close to the optimum levels required, thus inhibits the generation of acid mist in electrowinning cell without adversely affecting other parameters process as current efficiency, energy consumption or cathodic quality, obtaining cathodes of high quality, smooth and with good adhesion.