Crystallography and surface morphology evolution of thermally treated Cu thin films on SiO2/Si substrates

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In this work, we study the crystallization and surface morphology of Cu thin films (exposed to environment) growth on SiO2/Si subsstrates. The samples thermally treated using a tubular furnace bet ween temperature range 250-1000ºC during an elapsed time of 3 hours, after was cooling to a rate of 1.4...

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Detalles Bibliográficos
Autores: Hurtado Salinas, Daniel, Bustamante Domínguez, Angel, León Felix, Lizbet, De los Santos Valladares, Luis, Majima, Yutaka
Formato: artículo
Fecha de Publicación:2010
Institución:Universidad Nacional Mayor de San Marcos
Repositorio:Revistas - Universidad Nacional Mayor de San Marcos
Lenguaje:español
OAI Identifier:oai:ojs.csi.unmsm:article/8849
Enlace del recurso:https://revistasinvestigacion.unmsm.edu.pe/index.php/fisica/article/view/8849
Nivel de acceso:acceso abierto
Materia:Peliculas delgadas de Cu
subratos de SiO2/Si
MEB
DRX
cristalizacion
morfologia superficial
siliciuros de Cu
Cu thin films
SiO2/Si substrates
SEM
XRD
crystallization
surface morphology
Cu silicides.
Descripción
Sumario:In this work, we study the crystallization and surface morphology of Cu thin films (exposed to environment) growth on SiO2/Si subsstrates. The samples thermally treated using a tubular furnace bet ween temperature range 250-1000ºC during an elapsed time of 3 hours, after was cooling to a rate of 1.4ºC/min. The crystalization process was measured by X-ray difraction (XRD), meanwhile the surface morphology was observed with scanning electron microscopy (SEM). The results was analyzed and permit us to know the temperature dependecy of the dynamics of surface atoms on the Cu/SiO2 system, are the range between 400-500ºC. During the annealing an oxidation process on sample surfaces occur and the presence of Cu silicides are detected.
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