ELECTROPOLYMERIZATION OF PYRROLE ON COPPER AND HIS EVALUATION AS INHIBITOR IN THE PROCESSES OF CORROSION

• Autores: La Rosa-Toro Gómez, Adolfo, Vergaray D’Arrigo, Diego
• Formato: artículo
• Fecha de Publicación: 2022
• Institución: Sociedad Química del Perú
• Repositorio: Revista de la Sociedad Química del Perú
• Lenguaje: español
• OAI Identifier: oai:rsqp.revistas.sqperu.org.pe:article/386
• Enlace del recurso: https://revistas.sqperu.org.pe/index.php/revistasqperu/article/view/386
• Nivel de acceso: acceso abierto
• Materia: polypyrrole; corrosion; copper; polipirrol; corrosión; cobre

In this work, the electrochemical synthesis of the polypyrrole (Ppy) on passivated copper in different media for the study of the anticorrosive properties. These media: 0,3 mol L-1 oxalic acid, phosphate buffer at a concentration of 0,10 mol L-1 dihydrogen phosphate and 0,10 mol L-1 hydrogen phosphate and 0,25 mol L-1 sodium acetate covering a pH range of 1, 4 and 8 respectively. The electropolymerization process of pyrrole occurs in the potentials corresponding to the formation of Ppy, resulting in the adherence of a black material on them (Polypyrrole), characterized by Raman spectroscopy, a technique that informs us of the characteristic peaks of this material in our polymer, the main ones being obtained at 1540 cm-1 corresponding to the vibration of the carbon-carbon double bond in the polymer chain and the one corresponding to the Ppy+ at 1310 cm-1. Finally the studies of the anticorrosive activity by Tafel slopes results in an optimum value of 0,004 mm/year of corrosion rate for polypyrrole film electrodeposited by 40 cycles in oxalic acid against the corrosion rate of metallic copper of 0,907 mm/year.