FEM simulation of residual stresses of thin films for applications in MEMS

Descripción del Articulo

Finally, my deeply thanks to CONCYTEC for granting me a scholarship during this two-year studies.
Detalles Bibliográficos
Autor: Macavilca Román, José Carlos
Formato: tesis de maestría
Fecha de Publicación:2017
Institución:Consejo Nacional de Ciencia Tecnología e Innovación
Repositorio:CONCYTEC-Institucional
Lenguaje:inglés
OAI Identifier:oai:repositorio.concytec.gob.pe:20.500.12390/1825
Enlace del recurso:https://hdl.handle.net/20.500.12390/1825
Nivel de acceso:acceso abierto
Materia:Sistemas microelectromecánicos
Películas delgadas
Método de elementos finitos
https://purl.org/pe-repo/ocde/ford#2.00.00
https://purl.org/pe-repo/ocde/ford#2.03.01
id CONC_46dfa114b9d82fc6b732617eb968efb9
oai_identifier_str oai:repositorio.concytec.gob.pe:20.500.12390/1825
network_acronym_str CONC
network_name_str CONCYTEC-Institucional
repository_id_str 4689
dc.title.none.fl_str_mv FEM simulation of residual stresses of thin films for applications in MEMS
title FEM simulation of residual stresses of thin films for applications in MEMS
spellingShingle FEM simulation of residual stresses of thin films for applications in MEMS
Macavilca Román, José Carlos
Sistemas microelectromecánicos
Películas delgadas
Método de elementos finitos
https://purl.org/pe-repo/ocde/ford#2.00.00
https://purl.org/pe-repo/ocde/ford#2.03.01
title_short FEM simulation of residual stresses of thin films for applications in MEMS
title_full FEM simulation of residual stresses of thin films for applications in MEMS
title_fullStr FEM simulation of residual stresses of thin films for applications in MEMS
title_full_unstemmed FEM simulation of residual stresses of thin films for applications in MEMS
title_sort FEM simulation of residual stresses of thin films for applications in MEMS
author Macavilca Román, José Carlos
author_facet Macavilca Román, José Carlos
author_role author
dc.contributor.author.fl_str_mv Macavilca Román, José Carlos
dc.subject.none.fl_str_mv Sistemas microelectromecánicos
topic Sistemas microelectromecánicos
Películas delgadas
Método de elementos finitos
https://purl.org/pe-repo/ocde/ford#2.00.00
https://purl.org/pe-repo/ocde/ford#2.03.01
dc.subject.es_PE.fl_str_mv Películas delgadas
Método de elementos finitos
dc.subject.ocde.none.fl_str_mv https://purl.org/pe-repo/ocde/ford#2.00.00
https://purl.org/pe-repo/ocde/ford#2.03.01
description Finally, my deeply thanks to CONCYTEC for granting me a scholarship during this two-year studies.
publishDate 2017
dc.date.accessioned.none.fl_str_mv 2024-05-30T23:13:38Z
dc.date.available.none.fl_str_mv 2024-05-30T23:13:38Z
dc.date.issued.fl_str_mv 2017
dc.type.none.fl_str_mv info:eu-repo/semantics/masterThesis
format masterThesis
dc.identifier.uri.none.fl_str_mv https://hdl.handle.net/20.500.12390/1825
url https://hdl.handle.net/20.500.12390/1825
dc.language.iso.none.fl_str_mv eng
language eng
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
dc.rights.uri.none.fl_str_mv http://creativecommons.org/licenses/by-nc-nd/2.5/pe/
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-nd/2.5/pe/
dc.publisher.none.fl_str_mv Pontificia Universidad Católica del Perú
publisher.none.fl_str_mv Pontificia Universidad Católica del Perú
dc.source.none.fl_str_mv reponame:CONCYTEC-Institucional
instname:Consejo Nacional de Ciencia Tecnología e Innovación
instacron:CONCYTEC
instname_str Consejo Nacional de Ciencia Tecnología e Innovación
instacron_str CONCYTEC
institution CONCYTEC
reponame_str CONCYTEC-Institucional
collection CONCYTEC-Institucional
repository.name.fl_str_mv Repositorio Institucional CONCYTEC
repository.mail.fl_str_mv repositorio@concytec.gob.pe
_version_ 1853772949412118528
spelling Publicationrp04787600Macavilca Román, José Carlos2024-05-30T23:13:38Z2024-05-30T23:13:38Z2017https://hdl.handle.net/20.500.12390/1825Finally, my deeply thanks to CONCYTEC for granting me a scholarship during this two-year studies.In MEMS sensors, such as resonators based on cantilever and doubly-clamped beams, the presence of residual stresses in the thin films disrupt their mechanical properties or eigenfrequencies and, in some cases, can destroy the structure. This thesis aims to simulate the residual stresses in wafers composed of thin films deposited over a substrate. The simulations were conducted with ANSYS Workbench R17.2, a finiteelement-method software. This work considered static simulations with a single-layer wafer geometry, since it is a first approach to the simulation of residual stresses. With the purpose of achieving that, three simulation types were performed. Simulation 1 applied the thermal loads as heating and cooling steps to a quadrant model. Simulation 2 added the birth and death technique with the purpose of representing the deposition of the thin film. Besides, it was split under the geometric model as flat axisymmetric section, curved axisymmetric section, i.e. with the initial curvature of the wafer, and curved quadrant model. On the other hand, simulation 3 generated the residual stresses by the activation of the contact between the thin film and the silicon dioxide layer, used as diffusive barrier. The simulation results were compared to calculated values from measurements performed by the methods of wafer curvature and X-ray diffraction. The comparison showed that the curved quadrant model allowed obtaining residual stresses and deflections closer to the calculated ones. In addition, the curved axisymmetric models allowed visualizing the residual stresses distribution in the layers and the substrate. Thus, the birth and death technique was useful to simulate the deposition of the thin film. The considerations described in this work can be used as input data for more complex simulations based on MEMS structuresConsejo Nacional de Ciencia, Tecnología e Innovación Tecnológica - ConcytecengPontificia Universidad Católica del Perúinfo:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-nd/2.5/pe/Sistemas microelectromecánicosPelículas delgadas-1Método de elementos finitos-1https://purl.org/pe-repo/ocde/ford#2.00.00-1https://purl.org/pe-repo/ocde/ford#2.03.01-1FEM simulation of residual stresses of thin films for applications in MEMSinfo:eu-repo/semantics/masterThesisreponame:CONCYTEC-Institucionalinstname:Consejo Nacional de Ciencia Tecnología e Innovacióninstacron:CONCYTEC#PLACEHOLDER_PARENT_METADATA_VALUE#20.500.12390/1825oai:repositorio.concytec.gob.pe:20.500.12390/18252024-05-30 15:40:40.64http://creativecommons.org/licenses/by-nc-nd/2.5/pe/info:eu-repo/semantics/openAccesshttp://purl.org/coar/access_right/c_14cbinfo:eu-repo/semantics/closedAccessmetadata only accesshttps://repositorio.concytec.gob.peRepositorio Institucional CONCYTECrepositorio@concytec.gob.pe#PLACEHOLDER_PARENT_METADATA_VALUE#<Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="2c1b2f27-64e9-45bc-9c4a-fd721f5204f8"> <Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type> <Language>eng</Language> <Title>FEM simulation of residual stresses of thin films for applications in MEMS</Title> <PublishedIn> <Publication> </Publication> </PublishedIn> <PublicationDate>2017</PublicationDate> <Authors> <Author> <DisplayName>Macavilca Román, José Carlos</DisplayName> <Person id="rp04787" /> <Affiliation> <OrgUnit> </OrgUnit> </Affiliation> </Author> </Authors> <Editors> </Editors> <Publishers> <Publisher> <DisplayName>Pontificia Universidad Católica del Perú</DisplayName> <OrgUnit /> </Publisher> </Publishers> <License>http://creativecommons.org/licenses/by-nc-nd/2.5/pe/</License> <Keyword>Sistemas microelectromecánicos</Keyword> <Keyword>Películas delgadas</Keyword> <Keyword>Método de elementos finitos</Keyword> <Abstract>In MEMS sensors, such as resonators based on cantilever and doubly-clamped beams, the presence of residual stresses in the thin films disrupt their mechanical properties or eigenfrequencies and, in some cases, can destroy the structure. This thesis aims to simulate the residual stresses in wafers composed of thin films deposited over a substrate. The simulations were conducted with ANSYS Workbench R17.2, a finiteelement-method software. This work considered static simulations with a single-layer wafer geometry, since it is a first approach to the simulation of residual stresses. With the purpose of achieving that, three simulation types were performed. Simulation 1 applied the thermal loads as heating and cooling steps to a quadrant model. Simulation 2 added the birth and death technique with the purpose of representing the deposition of the thin film. Besides, it was split under the geometric model as flat axisymmetric section, curved axisymmetric section, i.e. with the initial curvature of the wafer, and curved quadrant model. On the other hand, simulation 3 generated the residual stresses by the activation of the contact between the thin film and the silicon dioxide layer, used as diffusive barrier. The simulation results were compared to calculated values from measurements performed by the methods of wafer curvature and X-ray diffraction. The comparison showed that the curved quadrant model allowed obtaining residual stresses and deflections closer to the calculated ones. In addition, the curved axisymmetric models allowed visualizing the residual stresses distribution in the layers and the substrate. Thus, the birth and death technique was useful to simulate the deposition of the thin film. The considerations described in this work can be used as input data for more complex simulations based on MEMS structures</Abstract> <Access xmlns="http://purl.org/coar/access_right" > </Access> </Publication> -1
score 13.406609
FEM simulation of residual stresses of thin films for applications in MEMS
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La información contenida en este registro es de entera responsabilidad de la institución que gestiona el repositorio institucional donde esta contenido este documento o set de datos. El CONCYTEC no se hace responsable por los contenidos (publicaciones y/o datos) accesibles a través del Repositorio Nacional Digital de Ciencia, Tecnología e Innovación de Acceso Abierto (ALICIA).

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